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Joseph Chon, Senior Director of Product Marketing for Data Center Interconnects, discusses the 2nm Libra and 2nm Electra optical DSPs with integrated MACsec and describes how standards-based pluggables will deliver scalable, terabit-scale connectivity for AI clusters.

Scale-across networking is in the middle of a historic shift away from traditional embedded systems for long-distance optics to modules. Modules can reduce the CapEx and OpEx of scale-across networks by up to 75%.1 Module bandwidth, efficiency, and reach, meanwhile, have been increasing at a predictable and fast pace. Supply chain flexibility, enabled by the growth of an ecosystem around pluggable coherent optical modules, has also reduced potential roadblocks to rapid scalability.

By 2030, pluggables will account for approximately 85% of scale-across ports shipped, 80% of bandwidth and 70% of revenue of the coherent market.2

Integrating MACsec accelerates this momentum by expanding the capabilities of coherent pluggable modules and empowering hyperscalers to enhance the resilience and security of their infrastructure.

  1. Cignal AI, Marvell, August 2023.
  2. Cignal AI, Optical Components Report, January 2026.

 

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Tags: AI infrastructure, Optical Interconnect, Optical DSPs, DSP, data center interconnect, AI

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