SANTA CLARA, Calif. – March 12, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced a major expansion of its 1.6T optical DSP platform portfolio, advancing the industry’s transition from 800G into 1.6T next-generation AI data center connectivity.
Marvell has a multi-generational history of industry firsts. The company was the first to introduce 200G/lane 1.6T DSPs in 5nm with Marvell® Nova in 2023, followed by the 3nm 1.6T Ara platform in 2024, which increased performance and reduced the power envelope as the demand for 1.6T modules expanded in 2025. Now shipping in mass volume to global customers, Ara is enabling the world’s hyperscalers and cloud providers to deploy 1.6T pluggable connectivity for AI data centers.
Today, Marvell is introducing the next wave of its 3nm 1.6T optical DSP platform portfolio, increasing performance per watt by optimizing separately for each high-volume use case and introducing new capabilities, including:
As AI infrastructure scales exponentially, connectivity has become the primary bottleneck of the modern data center, and the solution requires more than a “one-size-fits-all” approach. New, dedicated semiconductor interconnect solutions are required to address the increasing performance, power, design, security and application-specific challenges. With these new 1.6T offerings and an unmatched breadth and depth of expertise—and offering a full connectivity stack including industry-first DSPs, advanced SerDes, switching, interconnects, drivers and TIAs, and the Marvell® RELIANT™ interconnect telemetry platform—Marvell is uniquely positioned to address this demand.
“Marvell pioneered PAM DSP technology, and we continue to lead with advanced SerDes and production-proven 800G platforms. We are now extending that multi-generational product leadership into the 1.6T era,” said Xi Wang, senior vice president and general manager, Connectivity Business Unit at Marvell. “With these new products, Marvell will deliver the performance, power efficiency and manufacturing capacity required to keep up with the explosive growth of next-generation AI data centers.”
“The performance of today’s data centers—powered by hundreds of thousands of GPUs, XPUs and other advanced compute engines—depends on the interconnect technologies that link them together,” said Vladimir Kozlov, founder and CEO at LightCounting. “Marvell DSP products are essential to many high-speed links in modern data center infrastructure, enabling compute resources to operate at peak performance and efficiency. The company’s expanded 1.6T DSP portfolio ensures that data centers can fully maximize their compute investments well into the future.”
Broadest End-to-End Connectivity Portfolio
Marvell delivers the industry’s most comprehensive portfolio of connectivity platform solutions for scale-up, scale-out and scale-across AI infrastructure, with a vast global installed base across hyperscale and cloud deployments and millions of high-speed lanes deployed worldwide.
The Marvell portfolio spans the full data center connectivity stack, including DSPs, SerDes, switching, interconnects, drivers and TIAs to support all systems, devices, links and nodes across the network. The new offerings announced today extend the company’s existing 1.6T portfolio, which includes Marvell Ara, Alaska® and Nova DSPs, its Ethernet PHY platform, the Silicon Photonics Light Engine and the LPO TIA and laser driver chipset.
Marvell also provides supporting system-level technologies such as the Marvell RELIANT interconnect telemetry platform, which helps customers reduce operational complexity and improve network reliability and performance.
Last week, Marvell announced the expansion of its multi-generational 1.6T ZR/ZR+ and coherent DSP technology portfolio, underscoring the company’s commitment to continually deliver the latest scale-up, scale-out and scale-across technologies to drive AI innovation.
上市日期
Marvell Ara X, Ara T, Petra and Aquila M DSPs are sampling to customers beginning in Q1 2026.
Marvell will showcase its end-to-end connectivity portfolio at OFC 2026, March 15–19, at the Los Angeles Convention Center in Los Angeles, California. Visit the Marvell booth #1600 to learn how the company is driving the next generation of data center and AI infrastructure.
关于 Marvell
为了通过数据基础设施技术实现全球互联的愿景,我们正在构建非常强大的基础解决方案: 我们与客户携手。 30 年来,Marvell 深受世界位居前列的技术公司的信赖,以客户当前需求和未来理想为设计路线,运用专业半导体解决方案实现对全球数据的移动、存储、处理与保护。 通过深度协作、践行透明化的沟通方式,我们致力于促进未来企业、云和运营商架构的不断转型与完善。
###
Marvell 和 M 徽标是Marvell或其附属公司的商标。 请访问 www.marvell.com 网站获取Marvell商标的完整列表。 其他名称与品牌可能是其他方财产。
本新闻稿包含联邦证券法界定的前瞻性声明,该等声明涉及风险和不确定性。 前瞻性声明包括但不限于任何可能预测、预估、间接提及或暗示未来事件、结果或成就的声明。 实际事件、结果或成就可能与本新闻稿的预期存在重大差异。 前瞻性声明仅为预测,且受难以预测的风险、不确定性和假设的影响,这些风险、不确定性和假设包括 Marvell 的 10-K 年度报表中的“风险因素”部分、10-Q 季度报表以及 Marvell 不时向美国证券交易委员会 (Securities and Exchange Commission, SEC) 提交的其他文件中提及的内容。前瞻性声明仅在发表当日有效。 谨提醒读者不要过分依赖前瞻性声明,无论是由于新信息、未来事件还是其他原因,任何人都没有义务更新或修改任何此类前瞻性声明。
媒体联系方式:
George Millington
pr@marvell.com
媒体垂询,请联系 pr@marvell.com