Marvell Blogs

Posts Tagged 'Semiconductor'

• February 11, 2026

  

  

  

  Ripple Effects: Why Water Risk Is the Next Major Business Challenge for the Semiconductor Industry

  By Alua Suleimenova, Senior Sustainability Program Manager, Marvell

  

  This blog was originally posted in Semiconductor Engineering.

  The semiconductor industry is the bedrock of modern technology, enabling everything from AI and cloud computing to electric vehicles. Yet, this critical sector is also one of the most resource-intensive globally, with a substantial dependency on water. A single fabrication plant can demand up to 10 million gallons of water daily, comparable to the consumption of a city with 300,000 residents. Much of this water is, of course, reused and recycled through sophisticated systems. This immense water usage, particularly the requirement for ultrapure water for processes like cleaning and etching, makes consistent access to high-quality water a non-negotiable for operational reliability and business continuity. The new insights report “Ripple Effects: Water Risk and Resilience Across the Semiconductor Value Chain” provides the first global baseline of water risk hotspots for the semiconductor sector, assessing water risks across 140 facilities across 89 water basins to inform future risk mitigation strategies.

  Read More
• January 14, 2021

  

  

  

  What’s Next in System Integration and Packaging? New Approaches to Networking and Cloud Data Center Chip Design

  By Wolfgang Sauter, Customer Solutions Architect - Packaging, Marvel

  The continued evolution of 5G wireless infrastructure and high-performance networking is driving the semiconductor industry to unprecedented technological innovations, signaling the end of traditional scaling on Single-Chip Module (SCM) packaging. With the move to 5nm process technology and beyond, 50T Switches, 112G SerDes and other silicon design thresholds, it seems that we may have finally met the end of the road for Moore’s Law.¹ The remarkable and stringent requirements coming down the pipe for next-generation wireless, compute and networking products have all created the need for more innovative approaches. So what comes next to keep up with these challenges? Novel partitioning concepts and integration at the package level are becoming game-changing strategies to address the many challenges facing these application spaces.

  During the past two years, leaders in the industry have started to embrace these new approaches to modular design, partitioning and package integration. In this paper, we will look at what is driving the main application spaces and how packaging plays into next-generation system  architectures, especially as it relates to networking and cloud data center chip design.

  Read More

Recent Posts

• The Golden Cable Initiative: Enabling the Cable Partner Ecosystem at Hyperscale Speed
• Marvell Named to America’s Best Midsize Employers 2026 Ranking
• Ripple Effects: Why Water Risk Is the Next Major Business Challenge for the Semiconductor Industry
• Boosting AI with CXL Part III: Faster Time-to-First-Token
• Marvell Wins Interconnect Product of the Year for Ara 3nm 1.6T PAM4 DSP