The Device Packaging Conference, hosted by the International Microelectronics Assembly and Packaging Society (IMAPS), is the most comprehensive technical program and exhibition for the semiconductor packaging field. It is the place to explore the latest technologies and applications driving innovative packaging advancements.
Addressing Barriers to Co-packaged Optics
Date: Tuesday, March 3, 2026
Time: 6:45 – 8:00 PM
Location: Sheraton Grand at Wild Horse Pass
Marvell Presenters: Sid Suresh Pothukuchi, Director of Advanced Packaging
IMAPS Device Packaging Conference 2026
March 2–5, 2026
Sheraton Grand at Wild Horse Pass
Phoenix, Arizona
Feb 10, 2026
Feb 02, 2026
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