Podcast | Future Vision of Electronics Packaging

Mark Kuemerle, Distinguished Engineer - Integrated Systems Architect from Marvell’s ASIC Business Unit discusses electronic packaging with podcast host Chris Banuelos on the first episode of the Marvell Essential Technology Podcast. Mark returns from the 2021 IEEE’s Electronic Components and Technology Conference (ECTC), discussing some of the new developments in packaging technology that contribute to high integration and low power consumption.

The views, thoughts, and opinions expressed are the speaker's own and do not necessarily represent the views, thoughts, and opinions of Marvell or its afliates ("Marvell"). The content is provided for general informational purposes only and is not meant to be an endorsement or representation by Marvell or any other party. This podcast contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events or achievements. Actual events or results may differ materially from those contemplated in this podcast. 前瞻性声明仅在发表当日有效。 Listeners are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.