Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026

Extensive Technology Ecosystem Partners to Demonstrate Marvell-powered Offerings

SANTA CLARA, Calif. – February 24, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest data center connectivity products and technologies driving the next wave of AI innovation at DesignCon 2026—February 24 to 26 at the Santa Clara Convention Center in Santa Clara, California.

The primary bottleneck in AI data center infrastructure has shifted from compute to connectivity. Data center operators require scalable, ultra-high performance connectivity solutions to address the massive growth of new, more demanding AI workloads. To meet this challenge, Marvell is driving advancements in interconnect technology at the package-, server- and rack-level, working closely with an extensive partner ecosystem to deliver solutions that provide exceptional bandwidth, power savings and performance at scale.

At DesignCon 2026, Marvell will showcase the latest advances in its end-to-end data center connectivity portfolio. In a diverse lineup of panels and presentations, Marvell experts will review the latest in silicon, cabling, memory and other technologies for advanced data center infrastructure.

Additionally, Marvell plans to showcase the following demonstrations in it its DesignCon booth (#904):

• 40G die-to-die (D2D) interfaces for high-bandwidth memory (HBM)
•  224G LR SerDes over co-packaged copper (CPC)
• 200G/lane active copper cable (ACC)
•  PCIe 7.0 and PCIe 8.0 SerDes
• PCIe 6.0 active electrical cable (AEC)
•  1.6T active electrical cable (AEC)
   

Partner Booth Innovations

Ecosystem partners demonstrating Marvell-powered interconnect solutions include:

• Amphenol (Booth 833 and 1237)
• Foxconn Interconnect Technology (FIT) (Booth 719)
•  Infraeo (Booth 760)
• Luxshare-Tech (Booth 839)
•  Molex (Booth 739)
• Samtec (Booth 939)
• SENKO (Booth 958)
• TE Connectivity (Booth 639)
• Tektronix (Booth 819)
• 3M (Booth 420)

关于 Marvell

为了通过数据基础设施技术实现全球互联的愿景，我们正在构建非常强大的基础解决方案： 我们与客户携手。 30 年来，Marvell 深受世界位居前列的技术公司的信赖，以客户当前需求和未来理想为设计路线，运用专业半导体解决方案实现对全球数据的移动、存储、处理与保护。 通过深度协作、践行透明化的沟通方式，我们致力于促进未来企业、云和运营商架构的不断转型与完善。

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Marvell 和 M 徽标是Marvell或其附属公司的商标。 请访问 www.marvell.com 网站获取Marvell商标的完整列表。 其他名称与品牌可能是其他方财产。

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媒体联系方式：
George Millington
pr@marvell.com