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Marvell to Present at the 2023 IEEE 73rd Electronic Components and Technology Conference
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Marvell Presentations
Special Session 4
Title: Advanced Packaging Manufacturing in North America: Building the Ecosystem
Marvell Panelist: Joshua Dillon
Date: May 30, 2023
Time: 3:30 p.m. – 5:00 p.m.
Session 39: Interactive Presentations 3
Title: 2.5D Silicon Photonics Interposer Flip Chip Attach
Marvell Authors: Pushkraj Tumne, Hsiu-Che Wang, Dwayne Shirley, Roberto Coccioli
Date: June 1, 2023
Time: 10:00 a.m. – 12:00 p.m.
Program Session 22 : Large Substrate Process Integration Challenges
Title: Thermal Solutions for Large Die and Package
Marvell Authors: Choong Kooi Chee, Sean Hsu, Janak Patel, and Alaba Bamido
Date: June 1, 2023
Time: 4:45 p.m
Where to Find US
May 30-June 2, 2023
Orlando, Florida
Register here
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